Multiple-bit electrical fuses

ABSTRACT

A method for forming a semiconductor device includes forming a nanosheet stack comprising alternating layers of a first material and a second material on a substrate. The method further includes removing portions of the stack to form tapered stack sidewalls, which have a taper angle in relation to a horizontal surface of the substrate. The method further includes converting the second material to a resistive material. The layers that include the resistive material form one or more electrical fuses.

DOMESITIC PRIORITY

This application is a divisional of U.S. patent application Ser. No.15/585,826, filed May 3, 2017, the disclosure of which is incorporatedby reference herein in its entirety.

BACKGROUND

The present invention generally relates to semiconductor fabricationmethods and devices. More specifically, the present invention relates toforming multiple-bit electrical fuses (e-fuses) that can store multiplebits of data.

E-fuses are used in semiconductor-based integrated circuits (IC) for avariety of functions, including acting as a single-bit memory devicethat is permanent and cannot be erased. In many applications, groups ofe-fuses are used to store unique ID numbers for each individual IC. Atypical e-fuse has wide cathode and anode terminals while having anarrow “fusable” material between the two terminals. Each e-fuse canstore one bit of data, being either a “0” or “1” depending on theprogramming.

SUMMARY

Embodiments of the present invention are directed to a method forforming a semiconductor device. A non-limiting example of the methodincludes forming a nanosheet stack comprising alternating layers of afirst material and a second material on a substrate. The method furtherincludes removing portions of the stack to form tapered stack sidewalls,which have a taper angle in relation to a horizontal surface of thesubstrate. The method further includes converting the second material toa resistive material. The layers that include the resistive materialform one or more electrical fuses.

Embodiments are also directed to a semiconductor device. A non-limitingexample of the semiconductor device includes a semiconductor devicecomprising a nanosheet stack including tapered sidewalls formed on asubstrate. The nanosheet structure further includes a first electricalfuse vertically stacked on a second electrical fuse. A length of thefirst electrical fuse is less than a length of the second electricalfuse to define a multiple-bit fuse. A common anode and cathode areshared by the first and second electrical fuses. A dielectric materialisolates the first and second electrical fuses, and a pair of conductorcontacts is electrically connected to the anode and cathode.

Additional technical features and benefits are realized through thetechniques of the present invention. Embodiments and aspects of theinvention are described in detail herein and are considered a part ofthe claimed subject matter. For a better understanding, refer to thedetailed description and to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The specifics of the exclusive rights described herein are particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other features and advantages ofthe embodiments of the invention are apparent from the followingdetailed description taken in conjunction with the accompanying drawingsin which:

FIG. 1 depicts a cross-sectional view of a semiconductor structure usingstacked nanosheets according to one or more embodiments of the presentinvention;

FIG. 2 depicts a cross-sectional view of the semiconductor structureafter removing material to form a tapered nanosheet stack on thestructure according to one or more embodiments of the present invention;

FIG. 3 depicts a cross-sectional view of the semiconductor structureafter forming an anode base and cathode base according to one or moreembodiments of the present invention;

FIG. 4 depicts a cross-sectional view of the semiconductor structureafter forming an inter-level dielectric layer according to one or moreembodiments of the present invention;

FIG. 5 depicts a cross-sectional view of the semiconductor structureafter removing selected layers of the stack according to one or moreembodiments of the present invention;

FIG. 6 depicts a cross-sectional view of the semiconductor structureafter converting the second material to a silicide to form e-fusesaccording to one or more embodiments of the present invention;

FIG. 7 depicts a cross-sectional view of the semiconductor structureafter depositing a dielectric fill and forming conductor contactsaccording to one or more embodiments of the present invention;

FIG. 8A depicts a cross-sectional view of a completed e-fuse structureaccording to one or more embodiments of the present invention;

FIG. 8B depicts a chart showing details for programming the e-fusesdepicted in FIG. 8A according to one or more embodiments of the presentinvention; and

FIG. 9 depicts a cross-sectional view of a completed e-fuse structureshowing details of the geometries of the e-fuses and the stack taperangles according to one or more embodiments of the present invention.

The diagrams depicted herein are illustrative. There can be manyvariations to the diagram or the operations described therein withoutdeparting from the spirit of the invention. For instance, the actionscan be performed in a differing order or actions can be added, deletedor modified. Also, the term “coupled” and variations thereof describeshaving a communications path between two elements and does not imply adirect connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification.

In the accompanying figures and following detailed description of theembodiments of the invention, the various elements illustrated in thefigures are provided with two or three digit reference numbers. Withminor exceptions, the leftmost digit(s) of each reference numbercorrespond to the figure in which its element is first illustrated.

DETAILED DESCRIPTION

For the sake of brevity, conventional techniques related tosemiconductor device and integrated circuit (IC) fabrication can bedescribed in detail herein. Moreover, the various tasks and processsteps described herein can be incorporated into a more comprehensiveprocedure or process having additional steps or functionality notdescribed in detail herein. In particular, various steps in themanufacture of semiconductor devices and semiconductor-based ICs arewell known and so, in the interest of brevity, many conventional stepswill only be mentioned briefly herein or will be omitted entirelywithout providing the well-known process details.

The phrase “e-fuse” and variations thereof are used in this detaileddescription to include semiconductor devices that are operable aselectrical fuses. These electrical fuses operate according to principlesof electromigration and are capable of storing bits of data (e.g., “0”or “1”) based on the programmed state of the fuse.

Turning now to an overview of technologies that are more specificallyrelevant to aspects of the invention, electrically operable fuses,hereinafter referred to as “e-fuses” are utilized for a wide variety ofpurposes. There are challenges, however, in scaling e-fuses beyond the10 nm node. As semiconductor device critical dimensions continuouslyscale downward, and as the number of functions for a given semiconductordevice increases, the number of e-fuses required for performing all ofthe functions also increases. Conventional planar e-fuses require arelatively large on-die footprint. While fuse array structures have beenintroduced to manage a large number of planar e-fuses more efficiently,chip fabricators still face challenges when attempting to optimize thechip area and power load consumed by the e-fuses of a particular ICdesign. In addition, conventional e-fuses are limited to a single fuseand are capable of storing only a single data bit (i.e., either a “0” ora “1”). Therefore, chip surface is rapidly consumed as the amount ofoverall data to be stored by the e-fuses increases.

Turning now to an overview of aspects of the present invention, one ormore embodiments of the invention address the above-describedshortcomings of the prior art by forming one or more e-fuses in avertical stack orientation to form a multiple-bit fuse device. Providingmultiple stacked e-fuses on a chip surface enables the stacked e-fusesto operate as a permanent nonplanar memory in an IC. The stacked e-fusescan be covered with a conductive contact layer or other opaque material,which makes the stacked e-fuses resistant to reverse engineering. Inembodiments of the present invention, the e-fuse vertical stack isformed from nanosheets or nanowire layers having tapered stacksidewalls. Tapering the sidewalls allows for the stacked multiple-bitfuse device to include different fuse lengths having different breakdownvoltages. In this manner a multiple-bit e-fuse occupies a smallerfootprint than that required for storing the same number of bitsindividually in planar e-fuses. The stacked e-fuses are fabricatedaccording to embodiments of the invention to operate based on the theoryof electromigration, where current density plays a role in programmingthe e-fuses. Also, the physical parameters (e.g. length, width, height,type of material used) of the stacked e-fuses determines the totalresistivity and a breakdown voltage for each e-fuse.

In one or more non-limiting embodiments, each individual e-fuse includedin the stack has a different breakdown voltage due to difference intheir lengths with respect to one another. Accordingly, differentvoltages can be applied to obtain different combinations of brokenfuses. In this manner, the multiple-bit fuse device can be programmed toachieve different bits (e.g., 00, 01, 10, 11) based on the combinationof broken fuses.

The above-described aspects of the invention address the shortcomings ofthe prior art by forming a stacked e-fuse capable of storing multiplebits, while providing a reduced footprint. In this manner, increaseddata storage can be achieved using a reduced surface area of the chip.

Turning now to a more detailed description of aspects of the presentinvention, stacked e-fuses formed according to embodiments of thepresent invention are described in detail herein by referring to theaccompanying drawings in FIGS. 1-9. FIG. 1 depicts a cross-sectionalview of a starting semiconductor structure 100 formed from stackednanosheets or nanowires according to one or more embodiments of thepresent invention. The structure 100 will, after the fabricationoperations described herein, become a stacked e-fuse structurefabricated according to embodiments of the present invention. Thestructure 100 includes a semiconductor substrate 102. Formed over thesubstrate 102 is a plurality of alternating layers of a first material104 and alternating layers of a second material 106 that form a stack108. The first material 104 and the second material 106 are composed ofdifferent types of semiconductor material. For example, the firstmaterial 104 can be formed of silicon germanium (SiGe), while the secondmaterial can be formed of silicon (Si). In another embodiment, the firstmaterial 104 can be formed of Si, while the second material 106 can beformed of SiGe.

The substrate 102 can include Si, germanium (Ge), SiGe, silicon carbide(SiC), and those materials consisting essentially of III-V compoundsemiconductors. Other suitable substrates include II-VI compoundsemiconductors. The substrate 102 can also include an organicsemiconductor or a layered semiconductor such as, for example, Si/SiGe,a Si-on-insulator, or a SiGe-on-insulator. A portion or the entiresubstrate 102 can be amorphous, polycrystalline, or monocrystalline. Thesubstrate 102 can be doped or undoped, or contain doped regions andundoped regions therein. The substrate 102 can further include otherstructures (not shown) such as isolation structures.

The first and second layers 104, 106 can be formed from nano-typesemiconductor elements including, but not limited to, nanosheets andnanowires. In some embodiments, the first material 104 is sacrificialand will be removed during a later fabrication process as describedherein. In one or more embodiments, the first and second layers 104, 106are formed on the substrate 102 at the same time as field-effecttransistors (FET) and other devices are formed on the substrate 102.

FIG. 2 depicts a cross-sectional view of the semiconductor structure 100after removing material to form a tapered nanosheet stack on thestructure according to one or more embodiments of the present invention.FIG. 2 is a continuation of the processes discussed in FIG. 1. A set ofspacers 110 are added to a top surface of the stack 108. Once thespacers 110 are in position, a dummy gate 112 is added to the structure100 by filling the region between the spacers 110 by deposition andpatterning processes. The spacers 110 and dummy gate 112 act as a hardmask to protect portions of the stack 108 during later etching orremoval processes. Once the spacers 110 and dummy gate 112 are in place,a removal process is conducted to take away portions of the stack 108not covered by the spacers 110 and dummy gate 112. This removal processcreates an angled sidewall (tapered sidewall) with a taper angle θ to beformed by the sidewalls of the stack 108 in relation to a vertical planereference 113, or alternately, to a horizontal plane reference includingthe top surface of the substrate 102 which contacts the stack 108. Insome embodiments, the removal process includes a tapered etch process.Two methods of etching to remove material from the structure 100 includegas phase hydrofluoric acid (HCl) and a wet etch process with an etchantcontaining ammonia and hydrogen peroxide. Alternatively, the etchingprocess can include, but is not limited to, a directional anisotropicreactive-ion etching (RIE) process. Embodiments of the present inventionare not limited as to the specific process applied for etching thestructure, and other processes are possible. Other embodiments of thepresent invention can apply different etching processes and are notlimited herein. The positioning and total width of the spacers 110 inrelationship to a base width of the stack 108 (prior to the removalprocess) will determine the ultimate taper angle 113. The taper angle113 of the stack 108 is essential to the formation of e-fuses havingdifferent programmable voltages as described herein, as each e-fuseformed in this manner will have a different fuse length.

FIG. 3 depicts a cross-sectional view of the semiconductor structure 100after forming an anode base 114 and a cathode base 115 according to oneor more embodiments of the present invention. FIG. 3 is a continuationof the processes discussed in FIG. 2. An epitaxy growth process isapplied to the structure 100 to grown an anode base 114 and cathode base115 from the upper surface of the substrate 102. The anode base 114 andcathode base 115 fill the region previously occupied by material of thestack 108 which was removed as described in FIG. 2. The epitaxy processused to form the anode base 114 and cathode base 115 can be carried outusing, for example, vapor phase epitaxy (VPE), molecular beam epitaxy(MBE) or liquid phase epitaxy (LPE) with a gaseous or liquid precursor,such as, for example, silicon tetrachloride.

Dopants can be incorporated in the anode base 114 and cathode base 115during epitaxy (in-situ) or after epitaxy (ex-situ). Doping techniquesinclude ion implantation, gas phase doping, plasma doping, plasmaimmersion ion implantation, cluster doping, infusion doping, liquidphase doping, solid phase doping, or a combination of these techniques.Epitaxy materials can be Si, SiGe, or carbon-doped silicon (SiC).Dopants can be n-type or p-type. In some embodiments, the anode base 114and cathode base 115 locations are reversed. As the e-fuses are notpolarized devices, orientation of the anode base 114 and cathode base115 is not limiting and can be reversed.

FIG. 4 depicts a cross-sectional view of the semiconductor structure 100after forming an inter-level dielectric layer 118 according to one ormore embodiments of the present invention. FIG. 4 is a continuation ofthe processes discussed in FIG. 3. An inter-level dielectric (ILD) layer118 is deposited onto the top surface of the anode base 114 and thecathode base 115. In at least one non-limiting embodiment, the ILD layer118 can be blanket deposited so as to cover the upper surfaces of thespacers 110 and the dummy gate 112. A chemical-mechanical planarization(CMP) process can then be performed, which stops on the upper surface ofthe spacers 110 and the dummy gate 112.

Once the ILD 118 has been deposited, the dummy gate 112 is removed fromthe structure 100, creating a recess region 116 (recess) devoid ofmaterial. The recess region 116 exposes a layer of the first material104 located between the spacers 110. In one or more embodiments, aselective RIE etching process is performed that is selective to thematerial of the dummy gate 112. In this manner, the dummy gate 112 isremoved while maintaining to the spacers 110 and the ILD 118.

FIG. 5 depicts a cross-sectional view of the semiconductor structure 100after removing selected layers of the stack 108 according to one or morenon-limiting embodiments of the present invention. For example, thestructure 100 is shown after removing portions of the first material 104(of FIG. 4) while maintaining portions of the second material 106. Thesame or a different removal process as described in FIG. 2 can beperformed to selectively remove the portions of the first material 104with respect to the portions of the second material 106.

Removal of the portions of first material 104 results in the formationof a plurality of void regions (voids) 120 within the structure 100thereby releasing layers of the second material 106. The released layersof the second material 106 can be referred to as suspended semiconductornanosheets 106. When the second material 106 is formed as nanowires,than the removal of the first material forms suspended semiconductornanowires. The voids 120 and recess 116 provide spaces for thedeposition of additional material within the structure 100 as describedin the following figures. When the first material 104 is SiGe and thesecond material 106 is Si, the layers of SiGe 104 can be selectivelyremoved using a gas phase hydrochloride (HCl) etchant or a wet etchantcontaining hydroperoxide. In another embodiment where the first material104 is Si and the second material 106 is SiGe, the Si layers 104 can beselectively etched away with respect to the SiGe layers 106 using, forexample, a wet etch process containing ammonia (NH₃). When the materialintended to remain (i.e., be released) is already formed as a metalmaterial, the subsequent suspended semiconductor nanowires can beutilized as individual e-fuses without requiring additional materialconversion processes such as, for example, the subsequent silicideconversion described below in regards to FIG. 6.

FIG. 6 depicts a cross-sectional view of the semiconductor structure 100after applying a silicide conversion process to the maintained layers ofthe second material 106 (e.g., the suspended nanosheets 106) accordingto one or more embodiments of the present invention. The second material106 (e.g., the suspended nanosheets 106), the anode base 114, and thecathode base 115 are converted into a silicide material to form e-fuses126, 128 and 130. The formation of silicide onto the structure 100changes the second material 106 into a resistive material that is usedas an e-fuse. As described above, some embodiments allow for thematerial intended to remain (i.e., be released) to be formed as a metalmaterial, and therefore would not require conversion to a silicidematerial.

The conversion process includes depositing a layer of metal (e.g.,nickel, cobalt, or titanium, etc.) on the surface of the structure 100to cover the second material 106. The structure 100 is then heated suchthat the metal reacts with the Si to form silicide e-fuses 126, 128 and130. In some embodiments, the silicide includes nickel. After a heatingprocess is conducted to the structure 100, a nickel-silicide material isformed, for example. When the second material 106 is SiGe, the metalmaterial (e.g., nickel, cobalt, etc.) deposited on the layers 106 reactswith the SiGe when heated, and converts the layers 106 into silicidegermanide e-fuses 126, 128 and 130.

Any unreacted metal present can be removed after the formation of thesilicide or silicide germanide material. For example, typically thenanosheet/nanowire stack 108 and the anode base and cathode base 114,115 contain semiconductor materials (Si, SiGe, etc.). A layer ofsilicide is deposited onto the structure 100. The silicide material isdirectly applied to the anode base 114, cathode base 115, and the secondmaterial 106 (all of FIG. 5) to form a doped anode 122 (anode), a dopedcathode 124 (cathode), and e-fuses.

Continuing with FIG. 6, three e-fuses 126, 128, 130 (labeled fuse 1, 2,and 3, respectfully) are shown. However, more or fewer e-fuses can bepresent in a device. Each e-fuse 126, 128, 130 can be used to store onebit of information. If the e-fuse is closed or “unbroken”, the value ofthe e-fuse is 0. Likewise, if the e-fuse is open or “broken”, the valueof the e-fuse is 1. Therefore, the status of the e-fuse retains one bitof information. In at least one example, one or more of the e-fuses 126,128, 130 can only be broken once and cannot be repaired or restored. Inthis manner, the e-fuses 126, 128, 130 can permanently retain memory ofthe value of one bit and cannot be written over or reset. In order tostore the value of an individual e-fuse 126, 128, 130, the e-fuse mustbe “programmed” by either applying or not applying a breakdown voltageto the e-fuse in order to open or break the e-fuse. The breakdownvoltage creates a current in the e-fuse sufficient to break the e-fuse.An example of a process for programming the e-fuse is described in thefollowing figures.

FIG. 7 depicts a cross-sectional view of the semiconductor structure 100after depositing a dielectric fill 132 and forming conductor contactsaccording to one or more embodiments of the present invention. FIG. 7 isa continuation of the processes discussed in FIG. 6. The dielectriclayer 132 is deposited onto the structure 100, and fills the voids 120and recess 116 (of FIG. 6). The process continues with the structure 100being partially covered by a mask (not shown). In one or moreembodiments, an etching process is conducted to remove portions of theILD 118 from the structure 100. The purpose of the mask and the etchingprocess is to define regions where a plurality of conductor contacts 134will be deposited. The conductor contacts 134 is then deposited into theregions removed by the etching process, forming conductor contacts 134electrically connected to the anode 122 and cathode 124. In someembodiments, an optional planarization process can be performed toreduce the height of the structure 100 due to material overflow duringthe fabrication of the conductor contacts 134. Conductor contactmaterials include but are not limited to a metal (e.g., tungsten,titanium, tantalum, ruthenium, zirconium, cobalt, copper, aluminum,lead, platinum, tin, silver, gold), a conducting metallic compoundmaterial (e.g., tantalum nitride, titanium nitride, tantalum carbide,titanium carbide, titanium aluminum carbide, tungsten silicide, tungstennitride, ruthenium oxide, cobalt silicide, nickel silicide), carbonnanotube, conductive carbon, graphene, or any suitable combination ofthese materials. The conductive material can further include dopantsthat are incorporated during or after deposition.

FIG. 8A depicts a cross-sectional view of a completed e-fuse structure200 according to one or more embodiments of the present invention. Thestructure 200 includes the anode 122, the cathode 124, the first e-fuse126, the second e-fuse 128, and the third e-fuse 130 (labeled fuse 1, 2,and 3, respectfully). In other embodiments, four or more e-fuses can beformed within a structure 100, and is only limited by the number oflayers in the stack 108 (of FIG. 2). Each e-fuse 126, 128, 130 is adifferent length and requires a different breakdown voltage to break oropen the e-fuse. This feature is achieved based on the differentquantities of resistive material used to form the e-fuses 126, 128, 130due to the tapered sidewalls of the stack 108 as described in FIG. 2. Inat least one example, the first e-fuse 126 is shorter than the seconde-fuse 128 and the third e-fuse 130. In a similar manner, the seconde-fuse 128 is shorter than the third e-fuse 130. Thus, it will take lessbreakdown voltage to open the first e-fuse 126 than it will take to openthe second e-fuse 128 or the third e-fuse 130. In this manner, anoperator can apply a predetermined breakdown voltage to open one, two,or more e-fuses 126, 128, 130 as required.

FIG. 8B depicts a chart 250 showing details for programming e-fuses asdepicted in FIG. 8A according to one or more embodiments of the presentinvention. Chart 250 contains information relating to the structure 200as described in FIG. 8A. Structure 200 includes 3 e-fuses 126, 128, 130(i.e., e-fuses labeled 1, 2, and 3 respectfully). Each e-fuse 126, 128,130 has an equivalent resistance associated with it, with the equivalentresistance of each e-fuse 126, 128, 130 being a function of length.Therefore, the shortest e-fuse (e.g., e-fuse 126) has the least amountof resistance and therefore will break open at the smallest breakdownvoltage level as compared to longer-length e-fuses.

An operator reads the stored value of the e-fuses by measuring theresistance of the structure 200 after a breakdown voltage has beenapplied. The resistance measurement can be conducted by several methods,including but not limited to passing a known current through thestructure 200, measuring the resultant voltage, and applying Ohm's Lawto determine the resistance. By referencing chart 250 or similar, theoperator can then determine the state of one or more of the e-fuses 126,128, 130 and thus, their corresponding stored values. In chart 250, R1,R2, and R3 refers to the resistance of the e-fuses 126, 128, 130respectively, while the symbol “II” corresponds to a mathematicalfunction to determine the combined resistance for multiple resistors inparallel.

As an example, chart 250 shows that in order to store 2 bits as “00”,all three e-fuses 126, 128, 130 should remain closed (“FUSEBREAK=NONE”), and no breakdown voltage is required. If the operatorwishes to store the value “01”, e-fuse 1 should be ‘broken” or openwhile e-fuses 2 and 3 should remain closed. The e-fuses 126, 128, 130are then programmed by passing a breakdown voltage V1 through the commonanode 122 and cathode 124 of the structure 200 (of FIG. 8A). Byselecting the appropriate voltage, e-fuse 1 will break open whilee-fuses 2 and 3 remain unbroken or closed. In another example, in orderto store the value “10”, e-fuses 1 and 2 should be open while e-fuse 3should be closed. Finally, to store a value of “11”, all three e-fuses126, 128, 130 should be open. Due to the design of the e-fuses, e-fuse 2can only be open if e-fuse 1 is also open. Likewise, e-fuse 3 can onlybe open if e-fuse 1 and 2 are open. Therefore, three e-fuses 126, 128,130 can provide storage of two bits of information containing fourdifferent bit values: “00”, “01”, “10”, and “11”. Other embodiments arepossible using more than three e-fuses thereby storing a larger numberof bits.

FIG. 9 depicts a cross-sectional view of the structure 300 showinggeometric details between three e-fuses 302, 304, 306, for example, andstack taper angles according to one or more embodiments of the presentinvention. In this view, the relationship between e-fuse length andtaper angle is explained. The structure 300 includes a first length (L1)of e-fuse 1 302 (of FIG. 8A), a second length L2 of e-fuse 2 304, athird length (L3) of e-fuse 3 306, a taper angle 113 (defined as theangle from the vertical plane, or alternately, from the horizontal planeto the slope of the sidewalls of the stack as described in FIG. 2), aheight dimension 310 (H) between e-fuses 302-306 (corresponding to thedistance between second material 106 layers as described in FIG. 2), anda difference in length “dL” 312 defined as the change in length from onee-fuse to the next e-fuse present in the structure 300. The lengthmeasurements are used to determine the total resistance of a givene-fuse 126, 128, 130, and thus the breakdown voltage necessary to breakopen a particular e-fuse 126, 128, 130. Furthermore, the taper angle 113ensures that each e-fuse 126, 128, 130 is a different length, and thus adifferent resistance, and that e-fuses 126, 128, 130 increase in lengthand total resistance the further down a particular e-fuse 126, 128, 130is located in a stack.

As described herein, one or embodiments of the invention provide ane-fuse having a vertically stacked orientation. The stacked e-fuse has areduced footprint compared to convention e-fuses, but is capable ofstoring multiple bits instead of only a single bit. In this manner,several stacked e-fuses can be formed on a chip to achieve increaseddata storage while using less chip surface area.

Various embodiments of the present invention are described herein withreference to the related drawings. Alternative embodiments can bedevised without departing from the scope of this invention. Althoughvarious connections and positional relationships (e.g., over, below,adjacent, etc.) are set forth between elements in the followingdescription and in the drawings, persons skilled in the art willrecognize that many of the positional relationships described herein areorientation-independent when the described functionality is maintainedeven though the orientation is changed. These connections and/orpositional relationships, unless specified otherwise, can be direct orindirect, and the present invention is not intended to be limiting inthis respect. Accordingly, a coupling of entities can refer to either adirect or an indirect coupling, and a positional relationship betweenentities can be a direct or indirect positional relationship. As anexample of an indirect positional relationship, references in thepresent description to forming layer “A” over layer “B” includesituations in which one or more intermediate layers (e.g., layer “C”) isbetween layer “A” and layer “B” as long as the relevant characteristicsand functionalities of layer “A” and layer “B” are not substantiallychanged by the intermediate layer(s).

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

Additionally, the term “exemplary” is used herein to mean “serving as anexample, instance or illustration.” Any embodiment or design describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs. The terms “at least one”and “one or more” are understood to include any integer number greaterthan or equal to one, i.e. one, two, three, four, etc. The terms “aplurality” are understood to include any integer number greater than orequal to two, i.e. two, three, four, five, etc. The term “connection”can include an indirect “connection” and a direct “connection.”

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedcan include a particular feature, structure, or characteristic, butevery embodiment may or may not include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper,” “lower,”“right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” andderivatives thereof shall relate to the described structures andmethods, as oriented in the drawing figures. The terms “overlying,”“atop,” “on top,” “positioned on” or “positioned atop” mean that a firstelement, such as a first structure, is present on a second element, suchas a second structure, wherein intervening elements such as an interfacestructure can be present between the first element and the secondelement. The term “direct contact” means that a first element, such as afirst structure, and a second element, such as a second structure, areconnected without any intermediary conducting, insulating orsemiconductor layers at the interface of the two elements.

The phrase “selective to,” such as, for example, “a first elementselective to a second element,” means that the first element can beetched and the second element can act as an etch stop.

The terms “about,” “substantially,” “approximately,” and variationsthereof, are intended to include the degree of error associated withmeasurement of the particular quantity based upon the equipmentavailable at the time of filing the application. For example, “about”can include a range of ±8% or 5%, or 2% of a given value.

As previously noted herein, for the sake of brevity, conventionaltechniques related to semiconductor device and integrated circuit (IC)fabrication may or may not be described in detail herein. By way ofbackground, however, a more general description of the semiconductordevice fabrication processes that can be utilized in implementing one ormore embodiments of the present invention will now be provided. Althoughspecific fabrication operations used in implementing one or moreembodiments of the present invention can be individually known, thedescribed combination of operations and/or resulting structures of thepresent invention are unique. Thus, the unique combination of theoperations described in connection with the fabrication of asemiconductor device according to the present invention utilize avariety of individually known physical and chemical processes performedon a semiconductor (e.g., silicon) substrate, some of which aredescribed in the immediately following paragraphs.

In general, the various processes used to form a micro-chip that will bepackaged into an IC fall into four general categories, namely, filmdeposition, removal/etching, semiconductor doping andpatterning/lithography. Deposition is any process that grows, coats, orotherwise transfers a material onto the wafer. Available technologiesinclude physical vapor deposition (PVD), chemical vapor deposition(CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE)and more recently, atomic layer deposition (ALD) among others.Removal/etching is any process that removes material from the wafer.Examples include etch processes (either wet or dry), andchemical-mechanical planarization (CMP), and the like. Semiconductordoping is the modification of electrical properties by doping, forexample, transistor sources and drains, generally by diffusion and/or byion implantation. These doping processes are followed by furnaceannealing or by rapid thermal annealing (RTA). Annealing serves toactivate the implanted dopants. Films of both conductors (e.g.,poly-silicon, aluminum, copper, etc.) and insulators (e.g., variousforms of silicon dioxide, silicon nitride, etc.) are used to connect andisolate transistors and their components. Selective doping of variousregions of the semiconductor substrate allows the conductivity of thesubstrate to be changed with the application of voltage. By creatingstructures of these various components, millions of transistors can bebuilt and wired together to form the complex circuitry of a modernmicroelectronic device. Semiconductor lithography is the formation ofthree-dimensional relief images or patterns on the semiconductorsubstrate for subsequent transfer of the pattern to the substrate. Insemiconductor lithography, the patterns are formed by a light sensitivepolymer called a photo-resist. To build the complex structures that makeup a transistor and the many wires that connect the millions oftransistors of a circuit, lithography and etch pattern transfer stepsare repeated multiple times. Each pattern being printed on the wafer isaligned to the previously formed patterns and slowly the conductors,insulators and selectively doped regions are built up to form the finaldevice.

The flowchart and block diagrams in the Figures illustrate possibleimplementations of fabrication and/or operation methods according tovarious embodiments of the present invention. Variousfunctions/operations of the method are represented in the flow diagramby blocks. In some alternative implementations, the functions noted inthe blocks can occur out of the order noted in the Figures. For example,two blocks shown in succession can, in fact, be executed substantiallyconcurrently, or the blocks can sometimes be executed in the reverseorder, depending upon the functionality involved.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments described. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdescribed herein.

What is claimed is:
 1. A semiconductor device comprising: a nanosheetstack comprising tapered sidewalls formed on a substrate, the nanosheetstructure further comprising a first electrical fuse vertically stackedon a second electrical fuse, wherein a length of the first electricalfuse is less than a length of the second electrical fuse to define amultiple-bit fuse; a common anode and cathode shared by the first andsecond electrical fuses; a dielectric material isolating the first andsecond electrical fuses; and a pair of conductor contacts electricallyconnected to the anode and cathode.
 2. The semiconductor device of claim1, wherein the at least one electrical fuse includes a plurality ofelectrical fuses
 3. The semiconductor device of claim 2, wherein theplurality of electrical fuses defines two or more nanosheet layerscomprising a second material.
 4. The semiconductor device of claim 3,wherein each nanosheet layer forms a separate electrical fuse.
 5. Thesemiconductor device of claim 4, wherein each electrical fuse isconfigured to operate as a memory storage device.
 6. The semiconductordevice of claim 5, wherein the tapered sidewalls form electrical fusesof predetermined variable lengths
 7. The semiconductor device of claim6, wherein the variable lengths define variable resistances.
 8. Thesemiconductor device of claim 1, wherein each electrical fuse isprogrammed by applying a breakdown voltage.
 9. The semiconductor deviceof claim 6, wherein the plurality of electrical fuses define a combinedresistive value based on the variable lengths of each electrical fusebeing arranged in parallel to each other.
 10. The semiconductor deviceof claim 6, wherein the variable lengths create different combinedresistances.
 11. The semiconductor device of claim 10, wherein thecombined resistance increases from an upper surface of the nanosheetlayers stack to the substrate.
 12. The semiconductor device of claim 10,wherein a length of each electrical fuse defines a breakdown voltage.13. The semiconductor device of claim 11, wherein each electrical fuseshas a different breakdown voltage with respect to one another.
 14. Thesemiconductor device of claim 10, wherein the breakdown voltagesincrease from an upper surface of the nanosheet layers stack to thesubstrate.
 15. The semiconductor device of claim 1, wherein the at leastone electric fuse is covered with an opaque material.
 16. Thesemiconductor device of claim 15, wherein the opaque material inhibitsreverse engineering of the at least one electric fuses resistant. 17.The semiconductor device of claim 1, wherein the electrical fuses areconfigured to store bits of information.
 18. The semiconductor device ofclaim 17, wherein the bits of information are stored based on a state ofeach electrical fuse.
 19. The semiconductor device of claim 18, whereinthe state is one of a closed state or an open state.
 20. Thesemiconductor device of claim 19, wherein each electrical fusetransitions from the closed state to the open state when an appliedvoltage exceeds the breakdown voltage.